EAN: 9783031005756

Bilder-Quelle: discount24.de - Sport-Freizeit

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity microstip filters duplexers antennas) as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction Background on Technologies for Millimeter-Wave Passive Front-Ends Three-Dimensional Packaging in Multilayer Organic Substrates Microstrip-Type Integrated Passives Cavity-Type Integrated Passives Three-Dimensional Antenna Architectures Fully Integrated Three-Dimensional Passive Front-Ends References

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28.03.2025 um 12:08 Uhr

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