EAN: 9783319297446

Bilder-Quelle: shopping24.de – Sport

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs as innovative conducting material to fabricate interconnect through-silicon vias (TSVs) in order to improve the performance reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing modeling simulation characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

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04.04.2025 um 07:45 Uhr

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