EAN: 9783030146894

Bilder-Quelle: shopping24.de – Sport

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system encompassing all technologies between the two. To be able to make well-founded packaging decisions researchers need to understand a broad range of aspects including: concepts of transmission bands antennas and propagation integrated and discrete package substrates materials and technologies interconnects passive and active components as well as the advantages and disadvantages of various packages and packaging approaches and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing as well as associated testing and production costs and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.

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29.03.2025 um 10:02 Uhr

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