EAN: 9783319547138

Bilder-Quelle: shopping24.de – Sport

This book provides readers with an insightful guide to the design testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs including pre-bond testing of the silicon interposer at-speed interconnect testing built-in self-test architecture extest scheduling and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

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30.04.2025 um 16:59 Uhr

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